LOW-PROFILE ASSEMBLIES FOR PROVIDING BOARD LEVEL EMI SHIELDING FOR ELECTRICAL COMPONENTS ON OPPOSITE SIDES OF PRINTED CIRCUIT BOARDS

摘要

An EMI shielding assembly generally includes a frame attachable to the board's first side, and first and second covers configured to be respectively positioned on generally opposite sides of the board. The first cover is configured to cover at least one opening along an upper portion of the frame. The second cover is attachable to the first cover with the first and second covers respectively positioned along the board's generally opposite first and second sides. Accordingly, the assembly is operable for shielding one or more electrical components on the board's first side that are within a first interior defined by the frame's walls, first cover, and at least a portion of the board's first side, and one or more electrical components on the board's second side that are within a second interior defined by the second cover and at least a portion of the board's second side.