| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of coping with the increase of outer terminals (enlarging the number of pins) allocatable on the mounting surface, and a production method thereof. <P>SOLUTION: This semiconductor device comprises: a first semiconductor chip 15 which has a first main surface 15a having a plurality of first pads 14, a second main surface 15c having an area larger than that of the first main surface and opposite to the first main surface, and a side wall surface 15b connecting the first main surface with the second main surface; a semiconductor chip loading part 12 which has a third main surface 12a having a first region 12b loading the first semiconductor chip and a second region 12c surrounding the first region, and a fourth main surface 12i opposite to the third main surface; a first outer terminal 24 provided on the first main surface of the first semiconductor chip; a second outer terminal 24 provided on the second region of the semiconductor chip loading part; a first wiring 18 connecting the first pad with the first outer terminal; and a second wiring 18 connecting the first pad with the second outer terminal and provided over the first main surface, the side wall surface and the second region. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
