| 摘要 |
PROBLEM TO BE SOLVED: To prevent brightness and life of a light emitting device from degrading by enhancing heat dissipation characteristics. SOLUTION: Related to an infrared ray data communication module 12 wherein a module main body, wherein, with an electronic part such as a light emitting device 3, a photodetecting element, an IC chip, and a capacitor, etc. mounted on a circuit board 2, the upper surface of the light emitting device 3 and the photo-detecting element are sealed with a light-transmission sealing resin 6 so as to be covered with semi-spherical lens parts 6a and 6b, is shielded with a shield case 7 comprising stainless steel, aluminum, copper, and iron, etc., a through hole 13 communicating with a rear surface of the light emitting device 3 is formed on the circuit board 2, and an electrode pattern 14 which is directly connected to the light emitting device 3 and wired up to the rear surface of the circuit board 2 through the through hole 13 is formed. The heat generated at the light emitting device 3 is, without confined in an air layer 10, efficiently dissipated through the through hole 13 and the electrode pattern 14, so that brightness and life of the light emitting device 3 is prevented from degrading. |
