A FLEXIBLE SUBSTRATE ADHESION METHOD

摘要

A flexible substrate adhesion method is provided to alleviate the warp of a flexible substrate effectively by removing a stress caused by a difference in thermal coefficient between the flexible substrate and a carrier substrate. A flexible substrate adhesion method includes the steps of: preparing a carrier substrate(110); stacking an adhesive layer(120) on a carrier substrate; and stacking the flexible substrate on which at least one image display element is formed on the adhesive layer by using a laminating method or a pressing method. The laminating method uses a laminator including an upper roller(140a) rotating in the adhesive layer or in an upper part of the flexible substrate and a lower roller(140b) rotating in a lower part of the carrier substrate. The pressing method uses a press including an upper pressing unit formed in a top part of the flexible substrate and movable in a vertical direction, a fixation pressing unit formed in a lower part of the carrier substrate or lower pressing units movable in the vertical direction.