| 发明名称 |
Integrated circuit packages, systems, and methods |
| 摘要 |
An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die shadow region, and the second capacitor lies outside of the die shadow region. |
| 申请公布号 |
US7339263(B2) |
申请公布日期 |
2008.03.04 |
| 申请号 |
US20040880150 |
申请日期 |
2004.06.28 |
| 申请人 |
INTEL CORPORATION |
发明人 |
STONE BRENT S.;WOOD DUSTIN P.;RADHAKRISHNAN KALADHAR |
| 分类号 |
H01L23/02;H01L23/498;H01L23/50 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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