| 摘要 |
<p>Exposing equipment for fabricating a semiconductor device is provided to eliminate residuals remaining on a bridge between exposed patterns during an exposing process by using a track part and an exposing part. Exposing equipment has a track part(200) and an exposing part. The track part includes a photoresist applying device, a development apparatus, a heating and cooling apparatus, and an HMDS(hexamethyldisilazane) substrate surface treatment apparatus. The substrate surface treatment apparatus has an exhaust apparatus installed at an outer of a chamber(210) for sealing a process space when a substrate surface treatment process is performed, and a cover for separating the chamber from another space of the track part. The track part directs downwardly air flow around the substrate surface treatment apparatus. The substrate surface treatment apparatus is arranged on a position lower than a part of the heating and cooling apparatus in charge of a baking after an exposing process.</p> |
