| 摘要 |
<p>An apparatus and a method for processing a substrate are provided to remove easily a hardened photoresist in an ion implantation process, and to perform continuously a photoresist removal process, a rinsing process, and a drying process. A supporting unit(10) supports a substrate to direct a pattern surface of the substrate to an upper part. A dry-processing unit(20) removes a photoresist from an upper surface of the substrate by supplying plasma to the upper surface of the substrate. A wet-processing unit(30) removes the photoresist from the upper surface of the substrate by supplying chemicals to the upper surface of the substrate. The dry-processing unit includes a gas supply unit for supplying source gas to the upper surface of the substrate in a dry process, a plurality of upper electrodes positioned on the upper surface of the substrate in the dry process, and a lower electrode positioned on a lower part of the substrate to generate plasma.</p> |
