| 摘要 |
<p>This invention provides a method for removing a photoresist film from the surface of a substrate such as a semiconductor wafer or a liquid crystal substrate without replacement of a peeling liquid. After contact of a peeling liquid, composed mainly of an organic cyclic compound having two or more oxygen per molecule, for example, an alkylene carbonate, with a photoresist film on the substrate surface to remove the film, the film component contained in the peeling liquid is treated by ultrafiltration, and the peeling liquid, from which the film component has been removed, is circulated for reuse in the removal of the organic film on the substrate surface. The apparatus for removing an organic film on the surface of a substrate having an organic film comprises a mixed peeling liquid storage tank, into which a fresh peeling liquid and a treated peeling liquid are introduced, means for feeding the peeling liquid from the mixed peeling liquid storage means into a contact tank, a membrane filtration apparatus into which the peeling liquid discharged from the contact tank is introduced, and means for circulating the peeling liquid discharged from a membrane filtration apparatus to return the peeling liquid to the mixed peeling liquid storage tank. The removal method has excellent cost effectiveness and safety and, at the same time, does not adversely affect environment.</p> |
