| 摘要 |
<p>A semiconductor inspection device for inspecting an electronic device is disclosed. The semiconductor inspection device includes a contact probe including a plurality of column parts disposed in continuation, each of the column parts having different height, a conductive layer formed at least on the surfaces of the column parts, a holding part for holding the contact probe, and a through-hole electrode penetrating at least one of the column parts, wherein the contact probe and the holding part are integrally formed from a single silicon substrate. <IMAGE></p> |
