发明名称
摘要 PROBLEM TO BE SOLVED: To provide a molding method which does not need a resin film and prevents the occurrence of a void by residual air. SOLUTION: A resin layer 4 is formed on one surface of a mold 2. After a fiber reinforcing sheet 6 is stacked on the resin layer 4, a bag 8 is stacked on the stacked sheet 6, the rim of the bag is sealed airtightly to the mold 2, and air between the bag and the mold is evacuated. The fiber reinforcing sheet 6 is impregnated with the resin of the resin layer 4 by heating in an oven or an autoclave, and the resin is cured. COPYRIGHT: (C)2004,JPO
申请公布号 JP4052381(B2) 申请公布日期 2008.02.27
申请号 JP20020226535 申请日期 2002.08.02
申请人 发明人
分类号 B29B15/10;B29C43/10;B29C43/20;B29K101/00;B29K101/10;B29K105/06 主分类号 B29B15/10
代理机构 代理人
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