| 摘要 |
This invention provides a process for producing a wiring substrate, comprising providing a mold for wiring substrate formation comprising a support base and a mold pattern formed in a protruded form on one surface of the support base, the sectional width on the support base side in the identical section of the mold pattern being larger than the sectional width on the front side, penetrating the mold for wiring substrate formation into a curable resin layer to transfer, by the mold pattern, the mold pattern to the curable resin layer, curing the curable resin layer, then forming a laminate by demolding, precipitating an electrically conductive metal, and polishing the precipitated metal layer so as to expose the surface of a cured layer of the curable resin in the laminate to form a concave-shaped wiring pattern, and provides a wiring substrate formed by the production process. This invention also provides a process for producing a wiring substrate, comprising providing an organic insulating base material having a metallic thin film formed on its surface, abutting a precision press mold having a mold pattern on the surface of a press mold base against the surface of the metallic thin film, pressing the mold to form, in the organic insulating base substrate, a concave part corresponding to the press mold pattern formed on the precision press mold, then forming a metal plating layer having a larger thickness than the depth of the concave part to fill the concave part with the plating metal, then polishing the metal plating layer until the organic insulating base material is exposed, thereby forming a wiring pattern, and a wiring substrate produced by the production process.
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