发明名称 |
Multichip semiconductor device, chip therefor and method of formation thereof |
摘要 |
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.
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申请公布号 |
US7335517(B2) |
申请公布日期 |
2008.02.26 |
申请号 |
US20040902391 |
申请日期 |
2004.07.30 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HAYASAKA NOBUO;OKUMURA KATSUYA;SASAKI KEIICHI;MATSUO MIE |
分类号 |
H01L21/00;G01R31/26;H01L21/44;H01L21/4763;H01L21/768;H01L23/48;H01L23/64;H01L25/065;H01L25/10 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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