发明名称 |
Method for securing ceramic structures and forming electrical connections on the same |
摘要 |
A new kinetic spray process is disclosed that enables one to secure a plurality of ceramic elements together quickly without the need for glues or other adhesives. The process finds special utilization in the formation of non-thermal plasma reactors wherein the kinetic spray process can be used to simultaneously secure the ceramic elements together and to form electrical connections between like electrodes in the non-thermal plasma reactor.
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申请公布号 |
US7335341(B2) |
申请公布日期 |
2008.02.26 |
申请号 |
US20030697922 |
申请日期 |
2003.10.30 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
VAN STEENKISTE THOMAS HUBERT;MANTESE JOSEPH V.;LI BOB XIAOBIN;WETHEY PERTRICE AUGUSTE;JOHNSTON ROBERT PAUL;NELSON DAVID EMIL |
分类号 |
B01J19/08;B05D1/12;H05H1/24 |
主分类号 |
B01J19/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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