| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that an image sensor IC is affected by external stress. <P>SOLUTION: A camera module is provided which is obtained by assmbling a flexible wiring board 2 mounted with an image sensor IC 3, a lens holder 1 holding a camera lens in its upper portion and including an opening 1c where the image sensor IC 3 is housed, in its lower portion, and a sensor protecting case 4 for protecting the image sensor IC 3 on the flexible wiring board 2. A protrusion 4c which positions and supports the flexible wiring board 2 is formed in a frame part 4b of the sensor protecting case 4, a through-hole 2a which is engaged with the protrusion 4c provided in the frame part 4b of the sensor protecting case 2, is disposed on the flexible wiring board 2 and a flexure 2b is provided between the through-hole 2a and the image sensor IC 2. The lens and the image sensor IC can be easily positioned, the external stress is absorbed by the flexure provided on the flexible wiring board, then, influences upon the image sensor IC are reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
