摘要 |
A thermal module ( 10 ) includes a chassis ( 11 ) of an enclosure of an electronic device, a fin assembly ( 13 ) and a centrifugal blower ( 14 ) for producing an airflow flowing through the fin assembly. The centrifugal blower includes a housing ( 141 ), and the housing is integrally formed with the chassis as a monolithic piece. A U-shaped heat pipe ( 16 ) extends through the housing and has a condensing section ( 161 ) thermally connecting with the fin assembly and an evaporating section ( 162 ) attached to a heat spreader ( 12 ) for thermally connecting with a heat generating electronic component.
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