发明名称 THERMAL MODULE
摘要 A thermal module ( 10 ) includes a chassis ( 11 ) of an enclosure of an electronic device, a fin assembly ( 13 ) and a centrifugal blower ( 14 ) for producing an airflow flowing through the fin assembly. The centrifugal blower includes a housing ( 141 ), and the housing is integrally formed with the chassis as a monolithic piece. A U-shaped heat pipe ( 16 ) extends through the housing and has a condensing section ( 161 ) thermally connecting with the fin assembly and an evaporating section ( 162 ) attached to a heat spreader ( 12 ) for thermally connecting with a heat generating electronic component.
申请公布号 US2008043436(A1) 申请公布日期 2008.02.21
申请号 US20060309552 申请日期 2006.08.21
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 HUNG JUI-WEN;HWANG CHING-BAI
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址