| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sealing molded electronic-part having the high close-adhesion durability of a sealing resin layer with an electronic part, even when the electronic part is sealed with a thermoplastic resin composition. <P>SOLUTION: The sealing resin layer is stuck fast on the electronic part, contains an elastomer, has a tensile elastic modulus of 5 GPa or less at -40°C to +150°C, and has a tensile elongation of 3% or more. A stress generated by a heating or a cooling can be reduced and a peeling generated between the electronic part and the sealing resin layer can be inhibited on the basis of the difference of the coefficients of linear expansions with the electronic part by using such a sealing resin layer. The close-adhesion durability to a fatigue due to a thermal expansion and contraction can be improved. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
