METHODS AND SYSTEMS FOR COOLING A COMPUTING DEVICE

摘要

Various technologies for cooling a computer system are described. A computer system includes an enclosure having a number of vents distributed across different portions of the enclosure to provide different thermal pathways to transfer heat to air surrounding the computer system. The computer system is configured to be operable under different orientations. The enclosure is designed such that when the computer system is operating under a particular orientation, then at least one or more of the thermal pathways is able to transfer heat to air surrounding the computing system. Also, a processor and optionally a chipset reside within an interior region of the enclosure. A first cooling assembly is thermally coupled to the processor to cool the processor. Optionally, a second cooling assembly is thermally coupled to the chipset to cool the chipset.