| 发明名称 |
THERMAL TRANSFER CONTAINER FOR SEMICONDUCTOR COMPONENT |
| 摘要 |
A thermal transfer container is disclosed for a semiconductor component to transfer heat to a heat sink such as used in rectifiers for alternators. The thermal transfer container includes an outer cylindrical surface having threads that engage threads defined in the heat sink bore for electrically and thermally connecting the metallic cylindrical container to the heat sink.
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| 申请公布号 |
US2008042501(A1) |
申请公布日期 |
2008.02.21 |
| 申请号 |
US20070877737 |
申请日期 |
2007.10.24 |
| 申请人 |
MALANGA ROBERT;LASEK JOHN P;NGUYEN AN H;MAI TOAN V;OROPEZA FRANK C;OROPEZA FRANK W |
发明人 |
MALANGA ROBERT;LASEK JOHN P.;NGUYEN AN H.;MAI TOAN V.;OROPEZA FRANK C.;OROPEZA FRANK W. |
| 分类号 |
H02K11/04;H01L23/367;H01L25/11 |
主分类号 |
H02K11/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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