发明名称 METHOD AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To prevent dislocation due to pressing or suction failure or mounting error when sucking components or when mounting the sucked components, even when using a double-structure nozzle or the like wherein a nozzle slider slides in a nozzle inner. <P>SOLUTION: In the double-structure nozzle, displacement corresponding to a quantity of pressing occurs in the directions of X, Y and &theta;. Therefore, the displacement is found in a step 208. The correction quantity of position corresponding to the obtained displacement is calculated in a step 210 for a reference of mounting the component to the substrate. In a step 212, the mounting position (coordinate) is corrected based on the calculated correction quantity, and a head unit is moved in the directions of X and Y axes, so as to mount the component on the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008041712(A) 申请公布日期 2008.02.21
申请号 JP20060210135 申请日期 2006.08.01
申请人 JUKI CORP 发明人 AZUMA MORIO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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