| 摘要 |
A semiconductor package includes a ball grid array (BGA) substrate having integrated metal layer circuitry, a flip chip chip scale module package (CSMP) having a first integrated passive device (IPD), the flip chip chip scale module package attached to the ball grid array (BGA) substrate, and an application die attached to the integrated passive device (IPD). A method of manufacturing a semiconductor package includes providing a ball grid array (BGA) substrate having integrated metal layer circuitry, attaching a flip chip chip scale module package (CSMP) having a first integrated passive device (IPD) to the ball grid array (BGA) substrate, and attaching an application die to the integrated passive device (IPD).
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