发明名称 ASSEMBLING DEVICE, ASSEMBLING AND MANUFACTURING METHOD, AND ASSEMBLY LINE
摘要 PROBLEM TO BE SOLVED: To provide an assembling device, an assembling and manufacturing method, and an assembling line, which attain a higher speed and accuracy without increasing the size and the manufacturing cost. SOLUTION: The assembling device 3 receives parts from a part supply device 2 and assembles it to an assembling object W. The assembling device 3 consists of: a first part holding section 11 that receives the parts P from the part supply device 2; a first transfer device 12 that transfers the first part holding section 11 linearly or circumferentially from the delivery point of the part supply device 2 to the opposite position of a part assembling position of the assembling object W; a second part holding section 13 that receives the parts P from the first part holding section 11; and a second transfer device 14 that transfers the second part holding section 13 along the direction of the part assembling position of the parts P. The first transfer device 12 and the second transfer device 14 are independent from each other. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008036785(A) 申请公布日期 2008.02.21
申请号 JP20060215421 申请日期 2006.08.08
申请人 SEIKO INSTRUMENTS INC 发明人 MAKISHIMA YUTAKA;ISHII KAZUNORI;IWADATE MITSUO
分类号 B23P19/00;B23P21/00 主分类号 B23P19/00
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