| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder material in which, regarding high melting point lead-free solder having low toughness and easily generated with cracks, the propagation of generated cracks can be suppressed, and the durability of a joined structure can be improved. SOLUTION: The lead-free solder material is characterized in that at least metal fibers and/or ceramic fibers are dispersed into a solder alloy. COPYRIGHT: (C)2008,JPO&INPIT |
