SUBSTRATE-TREATING METHOD AND SUBSTRATE-TREATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To efficiently form a high-quality protection film for wiring on the surface of wires without deteriorating electrical characteristics of the wires. SOLUTION: This treatment method comprises the steps of: preparing a substrate that has embedded wiring formed in an insulation film so as to expose its surface outward and has been dried; pretreating the surface of the substrate with a chemical solution prior to a plating step; and selectively forming an electroless-plated protective film on the exposed surface of the wires immediately after the pretreatment. COPYRIGHT: (C)2008,JPO&INPIT