发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>A positive photosensitive resin composition excellent in sensitivity and resolution, characterized by comprising 100 parts by mass of (A) a hydroxypolyamide comprising repeating units represented by the general formula (1), 1 to 50 parts by mass of (B) a photoacid generator, 5 to 20 parts by mass of (C) a carboxylic acid compound having 6 to 18 carbon atoms as represented by the general formula (2), and 0.01 to 70 parts by mass of (D) an alcohol having 4 to 14 carbon atoms as represented by the general formula (3).</p>
申请公布号 WO2008020573(A1) 申请公布日期 2008.02.21
申请号 WO2007JP65729 申请日期 2007.08.10
申请人 ASAHI KASEI EMD CORPORATION;SHIBUI, SATOSHI 发明人 SHIBUI, SATOSHI
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
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