| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent uneven cooling by preventing leakage of cooling gas for dry etching from a through-hole when the notch of a wafer is aligned in a support plate having a plurality of through-holes in the thickness direction. <P>SOLUTION: The support plate 1 for supporting a wafer 5 provided with a plurality of through-holes in the thickness direction is constituted to have a positioning section 3 performing positioning when the wafer 5 is superimposed so that the through-holes are not exposed from the positioning section 3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
