| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering target for forming a barrier layer which is excellent in wettability with a Sn-Pb solder bump, can inhibit the diffusion of Sn being a component of the Sn-Pb solder, and can effectively prevent the reaction with an undercoat when the Sn-Pb solder bump is formed on the undercoat or a pad of a wiring and an electrode, formed on a substrate such as a semiconductor wafer and an electronic circuit, particularly the undercoat or the pad made of copper or a copper alloy. SOLUTION: The nickel alloy sputtering target for forming the barrier layer is a Ni-Sn alloy sputtering target capable of inhibiting the diffusion of Sn between the undercoat or the pad and the Sn-Pb solder bump. COPYRIGHT: (C)2008,JPO&INPIT
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