| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober system transfer tray which allows a prober system to measure not only semiconductor wafers but also semiconductor packages and allows positioning of semiconductor packages having various kinds of shapes. SOLUTION: The transfer tray 1 has a configuration in which an intermediate tray 30 is sandwiched between a lowermost tray 10 and an uppermost tray 20. The lowermost tray 10 and the uppermost tray 20 have a circular shape with a diameter D1. The diameter D3 of the intermediate tray 30 is smaller than the diameter D1. A screw hole section 32 is provided at the central part of the intermediate tray 30, and a fixing spacer screw 22 is screwed thereinto. A semiconductor package 40 is housed within a package housing pocket 11. The intermediate tray 30 is slid in the X-direction and Y-direction by the fixing spacer screw 22, thereby allowing the X, Y coordinates of the semiconductor package 40 to be positioned uniquely with respect to the transfer tray 1. COPYRIGHT: (C)2008,JPO&INPIT |
