发明名称 Semiconductor heatsink and process for producing the same
摘要 The sink has cooling fins ( 20a) projecting in a distance from each other on a base plate from a base part. The fins are held with a rectangular coupling base as connection partnet for an insert groove which is positioned in an upper surface of the plate. The fins are held fom-fit in the groove, A surface of the connecting partner is connected with the plate using a plastic with low viscosity such as synthetic resin (30). An independent claim is also included for a method for manufacturing a heat sink.
申请公布号 EP1691412(A3) 申请公布日期 2008.02.20
申请号 EP20060405036 申请日期 2006.01.26
申请人 ALCAN TECHNOLOGY & MANAGEMENT LTD. 发明人 BOCK, STEPHAN;BOCK, UWE
分类号 H01L23/367;H01L21/48 主分类号 H01L23/367
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