发明名称 |
CONNECTION STRUCTURE OF HIGH VOLTAGE FET AND COOLING PLATE FOR ELECTRONIC EQUIPMENT |
摘要 |
PURPOSE: A coupling structure of a high-voltage FET for electronic device and a cooling plate is provided to combine the high-voltage FET with a cooling plate by using a bolt and a nut. CONSTITUTION: A PCB(30) is installed in an inside of a main body. A cooling plate(10) is installed in the inside of the main body. A first through-hole(11) is formed on the cooling plate. A second through-hole(53) is formed at a center of a high-voltage FET(50). A connection pin(51) is formed at one side of the high-voltage FET. The high-voltage FET is coupled to the cooling plate by using a bolt and a nut. An insulating tube(67) is inserted between inner circumferences of the first and the second through-holes and an outer circumference of the bolt. An insulator(65) is formed between the high-voltage FET and the cooling plate. A silicon layer(70) is formed around the high-voltage FET. |
申请公布号 |
KR100804482(B1) |
申请公布日期 |
2008.02.20 |
申请号 |
KR20030001954 |
申请日期 |
2003.01.13 |
申请人 |
|
发明人 |
|
分类号 |
H01L23/36;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|