发明名称 CONNECTION STRUCTURE OF HIGH VOLTAGE FET AND COOLING PLATE FOR ELECTRONIC EQUIPMENT
摘要 PURPOSE: A coupling structure of a high-voltage FET for electronic device and a cooling plate is provided to combine the high-voltage FET with a cooling plate by using a bolt and a nut. CONSTITUTION: A PCB(30) is installed in an inside of a main body. A cooling plate(10) is installed in the inside of the main body. A first through-hole(11) is formed on the cooling plate. A second through-hole(53) is formed at a center of a high-voltage FET(50). A connection pin(51) is formed at one side of the high-voltage FET. The high-voltage FET is coupled to the cooling plate by using a bolt and a nut. An insulating tube(67) is inserted between inner circumferences of the first and the second through-holes and an outer circumference of the bolt. An insulator(65) is formed between the high-voltage FET and the cooling plate. A silicon layer(70) is formed around the high-voltage FET.
申请公布号 KR100804482(B1) 申请公布日期 2008.02.20
申请号 KR20030001954 申请日期 2003.01.13
申请人 发明人
分类号 H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/36
代理机构 代理人
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