| 摘要 |
The image sensor 52 is provided with a chip 53 having a image capturing surface 31 and a packaged to which the chip 53 is attached. The image capturing surface include a plurality of blocks 31 a to 31 d. Each of blocks 31 a to 31 d has image information read-out lines 39 . A position adjustment mechanism 55 is provided, which changes relative positions of the image capturing area 31 of the image sensor 52 and an optical axis 60 of an incident light from an optical system 51 to the image capturing area 31 , by ½ a longitudinal and lateral length of the blocks 31 a to 31 d.
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