| 摘要 |
PROBLEM TO BE SOLVED: To dry the surface of a substrate well while suppressing consumption of organic solvent constituents in a method and equipment for drying the surface of a substrate wet with liquid by using organic solvent constituents such as IPA. SOLUTION: While rotating a substrate W subjected to rinsing, a surface layer portion of rinse liquid (DIW) adhering to the surface Wf of the substrate is shaken off and removed therefrom. Subsequently, mixture liquid of IPA and DIW is supplied to the surface Wf of the substrate. Since the majority of rinse liquid on the surface Wf of the substrate is removed, liquid constituents adhering to the pattern gap is replaced by the mixture liquid even if a fine pattern FP is formed on the surface Wf of the substrate. Furthermore, collapse of pattern can be prevented effectively while suppressing consumption of IPA because the concentration of IPA of the mixture liquid supplied to the surface Wf of the substrate is set at 50% or less. COPYRIGHT: (C)2008,JPO&INPIT
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