DEFECT INSPECTING METHOD AND DEFECT INSPECTING APPARATUS

摘要

Provided is a defect inspecting method for inspecting a defect of a shape formed on a substrate. Primary inspection is performed by an optical method in sequence to prescribed patterns formed in a plurality of divided regions on the substrate, respectively, and a region to which secondary inspection is to be performed is selected from the regions. Secondary inspection is performed to the selected region by using an electron beam and a defect is detected.