发明名称 |
MANUFACTURING METHOD OF FIN STRUCTURE AND FIN TRANSISTOR ADOPTING THE FIN STRUCTURE |
摘要 |
A fin structure and a manufacturing method of a fin transistor using the same are provided to facilitate control of thickness and location of the fin structure by preventing deformation of the fin structure in a chemical mechanical polishing process through a capping layer. A manufacturing method of a fin transistor using a fin structure comprises the steps of: forming a plurality of mesa structures having a side wall corresponding to the fin structure on a substrate(1); forming an amorphous semiconductor layer(3) having a part directly formed on a surface of the substrate and a part formed in the side wall of the mesa structure; forming a capping layer(4) on the amorphous semiconductor layer; partially removing at least the amorphous semiconductor layer positioned on the mesa structure from the capping layer; and removing the mesa structure and the capping layer from a top with a predetermined depth. |
申请公布号 |
KR20080014453(A) |
申请公布日期 |
2008.02.14 |
申请号 |
KR20060076210 |
申请日期 |
2006.08.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOHANS SE YOUNG;PARK, YOUNG SOO;WENXU XIANYU |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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