发明名称 MANUFACTURING METHOD OF FIN STRUCTURE AND FIN TRANSISTOR ADOPTING THE FIN STRUCTURE
摘要 A fin structure and a manufacturing method of a fin transistor using the same are provided to facilitate control of thickness and location of the fin structure by preventing deformation of the fin structure in a chemical mechanical polishing process through a capping layer. A manufacturing method of a fin transistor using a fin structure comprises the steps of: forming a plurality of mesa structures having a side wall corresponding to the fin structure on a substrate(1); forming an amorphous semiconductor layer(3) having a part directly formed on a surface of the substrate and a part formed in the side wall of the mesa structure; forming a capping layer(4) on the amorphous semiconductor layer; partially removing at least the amorphous semiconductor layer positioned on the mesa structure from the capping layer; and removing the mesa structure and the capping layer from a top with a predetermined depth.
申请公布号 KR20080014453(A) 申请公布日期 2008.02.14
申请号 KR20060076210 申请日期 2006.08.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOHANS SE YOUNG;PARK, YOUNG SOO;WENXU XIANYU
分类号 H01L21/336 主分类号 H01L21/336
代理机构 代理人
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