| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus which is capable of being downsized and made to improve its reliability. SOLUTION: The solid-state imaging apparatus is configured in such manner that the free end of a flexible board 3 is bonded to the side of a solid-state imaging element chip 1, so as to dispose an electrode pad 2 provided on the surface of the solid-state imaging element chip 1, and a connecting electrode formed of the thick-walled part 6 of an internal wiring pattern 5 formed on the end surface of a flexible board 3 nearly on the same plane, and the electrode pad of the solid-state imaging element chip 1 is electrically connected to the connecting electrode of the flexible board 3 with a wire 9 by wire bonding to constitute the solid-state imaging apparatus. COPYRIGHT: (C)2008,JPO&INPIT
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