| 摘要 |
PROBLEM TO BE SOLVED: To provide a submount which loads electronic elements and has proper mounting characteristics, and that can reduce the thermal load by mounting. SOLUTION: In the submount, having a mounting part 3a for mounting an electronic element on one main face of an insulating substrate 1, a resistor layer 4, an insulating layer 5 and a solder layer 6 are sequentially laminated on an upper face of the mounting part 3a. At the loading of the electronic element on the mounting part 3a, the resistor layer 4 is made conductive, and only the resistor layer 4 and the periphery can be heated partially; and a solder layer 6 on the mounting part 3a is melted, and the electronic element can be mounted properly, while thermal load to the other part of the submount is effectively controlled. COPYRIGHT: (C)2008,JPO&INPIT
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