| 摘要 |
A pressure-sensitive adhesive sheets for wafer grinding is provided to enable a wafer to be ground even to an extremely small thickness without bending the wafer in a step of semiconductor wafer back-side polishing and a post-processing step. A pressure-sensitive adhesive sheet for semiconductor wafer processing includes a substrate and a pressure-sensitive adhesive layer disposed on the substrate. The pressure-sensitive adhesive sheet or the substrate has a thermal shrinkage ratio of 2% or lower after having been allowed to stand at 60 deg.C for 10 minutes. The pressure-sensitive adhesive sheet has a stress relaxation ratio at 2% elongation of 20% or higher at 1 minute after initiation of the elongated state in a tensile test. The pressure-sensitive adhesive sheet has a degree of elongation of 2% or lower in a silicon wafer application test of the pressure-sensitive adhesive sheet. The substrate is a laminate composed of two or more layers made of different materials. |
