发明名称 |
Acceleration sensor, semiconductor device and method of manufacturing semiconductor device |
摘要 |
The acceleration sensor according to the present invention includes a circuit chip having a prescribed circuit built into a front surface thereof; a sensor chip bonded to the front surface of the circuit chip; and a resin package for sealing the circuit chip and the sensor chip, while the sensor chip includes: a membrane arranged to oppose to the front surface of the circuit chip and having a plurality of openings; a piezoresistor formed on a surface of the membrane opposed to the circuit chip; a support section provided on a side opposite to the circuit chip with respect to the membrane and supporting a peripheral edge portion of the membrane; and a weight section provided on the side opposite to the circuit chip with respect to the membrane and integrally held on a central portion of the membrane. |
申请公布号 |
US2008034868(A1) |
申请公布日期 |
2008.02.14 |
申请号 |
US20070889289 |
申请日期 |
2007.08.10 |
申请人 |
ROHM CO., LTD. |
发明人 |
NAKATANI GORO;FUWA YASUHIRO;OKADA MIZUHO |
分类号 |
G01P15/12;H01C17/00;H01L29/84 |
主分类号 |
G01P15/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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