发明名称 Hot press for electronic devices and hot pressing method
摘要 An exemplary hot press ( 2 ) for bonding electronic devices ( 31, 32 ) includes a hot-head ( 24 ) and a control device ( 28 ). The hot-head includes a plurality of heating members ( 241 ). The hot-head includes a plurality of heating members ( 241 ) and a pressing end ( 243 ) joining same ends of the heating members. The pressing end is configured for pressing a bonding portion of one of the electronic devices. The heating members are configured for converting input electrical energy into heat and transferring the heat to the bonding portion of said one of the electronic devices via the pressing end. The control device is electrically connected with the heating members and configured for controlling the amount of the heat generated by each heating member.
申请公布号 US2008035264(A1) 申请公布日期 2008.02.14
申请号 US20070891799 申请日期 2007.08.13
申请人 INNOLUX DISPLAY CORP. 发明人 CHEN YI-YIN
分类号 B29C65/24 主分类号 B29C65/24
代理机构 代理人
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