| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry etcher which is equipped with an etching portion where a cleaning process is added to the dry etcher to expand the applicability of the dry etching to a metal film etching process and a cleaning portion. SOLUTION: As shown in Fig. 3, the dry etcher is equipped with an etching portion 100 which injects an etching gas to etch a film on a substrate, a transferring portion 300 which transfers the substrate treated in the etching portion 100, and a cleaning portion 200 which cleans up the substrate transferred from the transferring portion 300. COPYRIGHT: (C)2008,JPO&INPIT
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