| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component housing package wherein an electronic component is bonded well to the electrode of the electronic component housing package to house it well in a recess, and to provide an electronic device. SOLUTION: This electronic component housing package includes the recess 2 for housing the electronic component 4 at least at one principal surface of an insulating substrate 1. The electrode 3 to which the electronic component 4 is electrically connected is provided to an inner side surface of the recess 2. The electrode 3 may be separated from a bottom surface of the recess 2. COPYRIGHT: (C)2008,JPO&INPIT
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