NONCONTACT IC MEDIUM AND SYSTEM USING THE SAME

摘要

A coin type medium (10) is formed in such a manner that a known contactless IC module is embedded in a coin-shaped module medium. The coin-shaped module medium is of a structure that the module medium can be born by a medium holder. An engagement mechanism (10a) is provided that allows the engagement and disengagement of the module medium with respect to the medium holder by only displacement of the position of the engagement mechanism.