| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a samll high performance semiconductor device capable of preventing contact between adjacent wires having high flexibility of wire connection, and to provide its effective manufacturing method. <P>SOLUTION: The semiconductor device comprises a substrate 10 with an electrode 21 arranged on its surface, and a first semiconductor element 11A with an electrode 22 arranged on its surface and supported by the substrate 10. A first wire 41 is connected, to at least one electrode (at leat any of an electrode 21 and an electrode 22) arranged on at least any of the substrate 10 and the first semiconductor element 11A via a first bump 31, and a second wire 42 is connected to a part to be connected to the first wire 41 via a second bump 32. <P>COPYRIGHT: (C)2008,JPO&INPIT |
