ADHESIVE COMPOSITION, ADHESIVE FILM AND METHOD OF DETACHING

摘要

An adhesive composition composed mainly of a polymer obtained by copolymerization of styrene, a (meth)acrylic ester with cyclic structure and an alkyl (meth)acrylate with chain structure. The (meth)acrylic ester has a functional group dissociated from the ester bond by the action of heat, so that although the adhesion strength of the adhesive composition would not deteriorate at about 100°C, the adhesive composition when heated at 200°C or higher would foam to thereby invite deterioration of the adhesion strength. Accordingly, for example, at the detaching of support plate from semiconductor wafer, the time required to detach an adhesive layer from the semiconductor wafer can be shortened. Further, as this adhesive composition has its adhesion strength not deteriorated at about 100°C but deteriorated when heated at 200°C or higher, there can be attained easy detaching of the adhesive layer from the substrate.