PROCESS FOR SURFACE MODIFICATION OF POLYIMIDE RESIN LAYERS AND PROCESS FOR PRODUCTION OF METAL-CLAD LAMINATES

摘要

The invention relates to a surface treatment process for enhancing the adhesiveness of polyimide resin layers dramatically by simple surface treatment. This process brings about enhancement in the adhesiveness of polyimide resin layers even to a low-roughness copper foil suitable for fine-pitch pattern formation and can give metal-clad laminates useful as substrates for high-density printed wiring boards and HDD suspension. The process comprises the step (a) of treating the face of a polyimide resin layer with plasma to form a plasma-treated surface and the step (b) of applying a solution of an amino compound in a polar solvent on the plasma-treated surface and drying and heat-treating the resulting coating to form a surface modification layer. A polyimide resin layer obtained by the process which bears a modification layer on the face can advantageously give metal-clad laminates useful as wiring substrates by forming a metal layer on the surface of the modification layer by means of thermocompression bonding or vapor deposition.