| 摘要 |
<p>A method for forming a composite metal layer on a substrate comprises providing nanocrystalline particles of a first metal, adding the nanocrystalline particles to a plating bath that contains ions of a second metal to form a colloid-like suspension, immersing the substrate in the plating bath, and causing a co-deposition of the second metal and the nanocrystalline particles of the first metal on the substrate to form the composite metal layer. The co-deposition may be caused by inducing a negative bias on the substrate and applying an electric current to the plating bath to induce an electroplating process. In the electroplating process, the ions of the second metal are reduced by the substrate and become co-deposited on the substrate with the nanocrystalline particles of the first metal to form the composite metal layer.</p> |
