| 摘要 |
<p>A semiconductor wafer holding method and a semiconductor wafer holding apparatus, and a semiconductor wafer holding structure are provided to support a semiconductor wafer with a ring frame by attaching an adhesive tape to a whole rear side of the semiconductor wafer without bending and wrinkles. A semiconductor wafer holding method attaches a semiconductor wafer (W) to a ring frame(f) with an adhesive tape(DT). A ring type convex part(r) is formed in a circumference of a rear side of the semiconductor wafer for surrounding a flat concave part(b) formed by back grind. The rear side of the semiconductor wafer is pressed to an adhesive side of the adhesive tape attached to the ring frame, so that the ring type convex part is attached to the adhesive tape. The adhesive tape is pressed and transformed from non-adhesive side, so that the adhesive tape is pressed and attached to the flat concave part of the rear side of the wafer.</p> |
