| 摘要 |
A cleaning apparatus is provided to perform a parallel process in an upper layer and a lower layer of cleaning lines, thereby increasing a wafer processing speed per unit bottom area and improving the rate of operation. A cleaning apparatus(2) includes cleaning lines composed of an upper layer(2B) and a lower layer(2A), and a central conveyor and a sectional conveyor(9). Each cleaning line includes a plurality of cleaning processing chambers(2a-2h) performing cleaning and drying processes which are necessary to a wafer(W) after polishing. The central conveyor carries the wafer after polishing to each cleaning processing chamber in the upper layer and the lower layer of the cleaning lines, and carries a processed wafer from the cleaning processing chamber. The sectional conveyor carries the wafer successively to adjacent cleaning processing chambers in the upper layer and the lower layer of the cleaning lines.
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