| 摘要 |
A contact assembly is provided to prevent buckling or transformation of a vertical probe and to reduce electric capacity by arranging a dummy unit near to the vertical probe and installing an earth unit. A resin film(21) configures a substrate. A conductive pattern is formed on the resin film. The conductive pattern is comprised of a conductor including a vertical probe. A conductive beam configures a link instrument of a parallel spring having a parallelogram shape and is connected to the vertical probe. Two or more transformed beams(23,24) are incorporated with to the conductive beam. A dummy unit is installed on the link instrument of the parallel spring under the state of being electrically insulated from the conductive beam. Plural resin films are laminated and the end of the vertical probe is contacted to an electrode pad of a semiconductor chip to perform a circuit inspection process on the semiconductor chip. |
