发明名称 |
Semiconductor chip and tab package having the same |
摘要 |
A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.
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申请公布号 |
US7329597(B2) |
申请公布日期 |
2008.02.12 |
申请号 |
US20050261260 |
申请日期 |
2005.10.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHUNG YE-CHUNG;KIM DONG-HAN;KANG SA-YOON |
分类号 |
H01L21/44;H01L23/48 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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