POLISHING PAD MANUFACTURING APPARATUS AND METHOD THEREOF

摘要

A polishing pad manufacturing apparatus and method are provided to minimize a heat-effected zone on a polishing pad by using a laser beam with the wavelength of 10.4mum to 10.6mum. A polishing pad manufacturing apparatus comprises a CO2 laser oscillator(10), a galvanometer(30), a laser power meter(50), a beam expander(20), more than one scan lens group(40), and an X-Y stage system(200). The CO2 laser oscillator has a wavelength ranging from 10.4mum to 10.8mum. The galvanometer allows a beam projected by the laser oscillator to scan a predetermined area. The laser power meter measures the laser power of the laser beam transmitting the galvanometer in real time. The beam expander controls the size of the laser beam from the galvanometer to the laser. The scan laser group controls the laser beam from the galvanometer to be vertically projected onto a predetermined area. The X-Y stage moves the predetermined area. The galvanometer includes at least more than one reflection mirror whose diameter is more than 20mm so as to minimize beam spot size.